techno.rentetan.com – The company confirmed that it would have the Qualcomm Snapdragon 888 Plus chipset, as revealed on 28 June, when it was the first confirmation for the Honor Magic 3.
The use of this plant is an indication of what can be anticipated from the flagship, but now that a Twitter render shows that Magic 3 has a selfie camera underneath.
The bill matches. After all, Honor Magic 2 was designed to hide the headphone back in 2018 – an innovative way. Now, times have changed, with the cameras already under display (as seen in the ZTE Axon 20 5G), so it is quite probable that small piece of magic will become one of the points of sale of Honor Magic 3.
The Snapdragon 888 Plus chipset does not only support some high quality features, including up to 200-megapixel capacity in a single rear camera. The “standard” SD888 supports this, but it has not been used by a phone-maker. So we don’t expect to see a back 200MP in the Honor, although we’re rumours.
The charging is much the same. Qualcomm disclosed Quick Charge 5 with speeds up to 100W back in July 2020. But such speeds in consumer equipment weren’t immediately realized and we’re only talking about the possibility one year later. Is the Honor Magic 3 one of the first to charge super-fast?
Well, we’re only going to have to wait and see. Although the date of revelation is rumored, there is not a lot of information about what to expect of the Honor entry flagship in the public domain – except, of course, confirmation of the names of the Honor Magic 3 series and presence of Snapdragon 888 Plus.